Once again we are among an impressive list of finalists for an important industry award. This time it is for one of the Elektra Awards (electraawards.co.uk). Thank you to our customers and the esteemed list of judges for recognizing the uniqueness of our System in Package and promoting us to finalist for the “Internet-of-Things Product Innovation Award”. We are honored to be among 14 companies, all with very impressive entries, most of whom are over 100 times our size. (For details of not only the award for which we are a finalist but all of the categories go to https://www.elektraawards.co.uk/elektraawards2019/en/page/2019-products-shortlist )
The July 2019 Newsletter includes an exciting industry award announcement plus new application notes for AM335x on ethernet and industrial control as well as CubeMX software for STM32MP1. (Read More…)
Are you tired of spending all your time re-inventing the wheel? Unfortunately, many embedded engineers do just that; spend countless hours integrating the same core systems components over and over again. The OSD335x C-SiP allows you to break the cycle by providing an easy to use, complete system in a single package that integrates all of the core components that you need for your embedded system. Provide power, connect your peripherals, and you are ready to go. This single chip computer is so easy to use, you can now ‘dead bug’ a 1GHz Linux computer. (Read More…)
Empowering Electronic Engineers – OrCAD and Octavo Systems’ System-in-Package share this focus. Now by adding an OrCAD symbol library for the C-SiP, we empower embedded systems design engineers with more time to add features to new applications. Download the OrCAD library from our website.
Completing an embedded design in record time. Reducing the BOM to very few devices. Giving a designer time to add more features to the application. Sound like your wish list? C-SiP is the answer.
The goal of our System-in-Package technology is to create modular building blocks that abstract away tedious, repetitive, and complex tasks that designers are forced to spend time on, but don’t really add value to the end system so that they can create better, more innovate products. At Octavo Systems, we designed a completely integrated 1GHz Arm® Cortex®-A8 computing platform, the OSD335x C-SiP™. The OSD335x C-SiP (Complete System-In-Package) integrates the required components for a computing system into a single IC package.
Today we took another step in making designing with the C-SiP easier by adding an Altium symbol library for you to download from our website.
The OSD3358-SM-RED is our Reference, Evaluation and Development platform for the OSD335x Family of System-in-Package (SiP) devices. It was designed to make it easy for anybody with some knowledge or a desire to learn to begin developing applications on the OSD335x family of SiPs. In fact, it is so easy to use even a Marketing Person like me can quickly develop on it!
Here at Octavo Systems, we pride ourselves in making our devices easy to use. This extends to reducing the challenges that designers have in laying out a new printed circuit board (PCB). Our System-in-Package devices by their very nature will reduce a bill of materials (BOM) from over one hundred discreet devices to only one. This saves enormous amounts of layout time and effort purely from a component placement and routing point of view. However, Octavo Systems goes to the next level in simplifying your design layout.
Ball-grid Array (BGA) packages can be difficult to route during layout. Routing out, or escaping, the signals on the inner balls of a BGA can be difficult and can add many layers to the PCB. However, the ball maps of our System-in-Package devices are specifically designed from a system integration point of view. By moving all signal pins to the outer three rows and columns, with the 1.27mm (50 mil) ball pitch, it allows all signals to be escaped in one PCB layer with very standard 0.15mm (6 mil) trace / space routing rules. Then we designed the power inputs and outputs to be easy to use by grouping the ball together such that it is easy to use copper pours to connect them together. Similarly all control signals between the processor and power management IC (PMIC) are pinned out next to each other for easy connections. This not only reduces design complexity but makes laying out the BGA much easier which saves engineering time and money.
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