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Bringing System-In-Package to the World
Octavo Systems is bringing System-In-Package (SiP) Technology to the Embedded World Conference, February 27 – March 1, 2018 in Nuremberg, Germany. Our SiP technology enables you to build smaller more reliable systems, quicker and at a lower total system cost. Whether you are controlling large industrial machines, monitoring small vibrations along a fault, or building the next great web-connected consumer product, SiP can help you. Come to Hall 3A, Stand # 630 to discover how.
Get a free conference pass. Enter E-Code B389816 when registering.
SiP Example Applications
We will be demonstrating sample applications that benefit from our SiP technology. This is just a small subset of what can be done with this innovative technology. If you are curious to see if your application can benefit from SiP solution come by and see us.
Machine Vision and Industrial Control
Applications needing machine vision, number crunching might and precise control abilities are an easy task for the OSD335x SiP device. Exemplified with a Rubik’s cube solving robot, this demo using the BeagleBone Blue, shows an industrial control application in a miniature form. The device can handle many sensor inputs and produce more than 50 PWM signals, making it the optimum solution for control. More info.
IoT and Sensors
Bringing together many sensor inputs in your IoT application? System-In-Package technology gives you a perfect resource to aggregate and control a variety of inputs and outputs simultaneously in a tiny package. The OSD3358-SM-RED development platform provides an easy to use reference design to get you started. More info.
Commercial and General Computing
Get to market quickly with a low cost development platform. PocketBeagle® featuring The OSD335x-SM, gives developers access to the performance and compact size of System-In-Package at only $25. At only 35mm x 55mm it’s the smallest and lowest cost Linux computer. Our whac-a-mole project shows the simplicity of getting started with this powerful system.
Experience and Support
Octavo Systems was founded by and is built around industry experts. We are leading the charge to bring System-In-Package technology to the masses. We have an experienced engineering staff that is ready to help guide you through adopting this innovative technology into your application. We can’t wait to talk to you.
Headed to the show? Schedule a meeting with us to discuss your application.
Look forward to seeing you this year at Embedded World!
OSD32MP1 Powers AI at the Edge – MPCAM
When most of us think of Artificial Intelligence (AI) we think of large server farms doing complex calculations. In this paradigm for a product to leverage AI it would need to connect and send data to these servers to do their AI magic and then return the answer to the device, similar to Alexa. However, with the continued advancements in performance along with the reduction of size and power of processors, like the OSD32MP1 System-in-Package (SiP) featuring the STM32MP1, it is possible to run AI algorithms right on the local product, at the Edge.
The MPCAM from Siana Systems is an example of just such a platform. Featuring the OSD32MP1 SiP it is a platform that does Computer Vision (CV) at the edge. (Read More…)
Industry’s Smallest 800MHz STM32MP1 Module Shortens Design Time with New Suite of Tools
Octavo Systems OSD32MP15x System In Package Releases into Production with Higher Performance and Two New Development Platforms
Austin, Texas, United States (February 25, 2020) – Octavo Systems, an ST Authorized Partner, today expanded its support of the OSD32MP15x System in Package, the smallest available STMicroelectronics STM32MP1 module, with a production release at speeds up to 800MHz, and two new development boards.
OSD32MP15x System in Package In Production at Speeds Up to 800MHz
The Time Value of Design
As processor based products become more pervasive in the industry, it seems that the time required to get a new product to market is lengthening. A major time period of getting the product to market is during the product development stage. Over my career I have seen the product development process taking from 12 months to 2 or more years. Our direction at Octavo has been to help you reduce your development time to production ramp by using system in package (SiP) technology. (Read More…)
Octavo Highlights From Embedded World 2019!
Octavo Systems is bringing System-In-Package (SiP) Technology to the Embedded World Conference, February 27 – March 1, 2018 in Nuremberg, Germany. Our SiP technology enables you to build smaller more reliable systems, quicker and at a lower total system cost. Whether you are controlling large industrial machines, monitoring small vibrations along a fault, or building the next great web-connected consumer product, SiP can help you. Come to Hall 3A, Stand # 630 to discover how.
Get a free conference pass. Enter E-Code B389816 when registering.
SiP Example Applications
We will be demonstrating sample applications that benefit from our SiP technology. This is just a small subset of what can be done with this innovative technology. If you are curious to see if your application can benefit from SiP solution come by and see us.
Machine Vision and Industrial Control
Applications needing machine vision, number crunching might and precise control abilities are an easy task for the OSD335x SiP device. Exemplified with a Rubik’s cube solving robot, this demo using the BeagleBone Blue, shows an industrial control application in a miniature form. The device can handle many sensor inputs and produce more than 50 PWM signals, making it the optimum solution for control. More info.
IoT and Sensors
Bringing together many sensor inputs in your IoT application? System-In-Package technology gives you a perfect resource to aggregate and control a variety of inputs and outputs simultaneously in a tiny package. The OSD3358-SM-RED development platform provides an easy to use reference design to get you started. More info.
Commercial and General Computing
Get to market quickly with a low cost development platform. PocketBeagle® featuring The OSD335x-SM, gives developers access to the performance and compact size of System-In-Package at only $25. At only 35mm x 55mm it’s the smallest and lowest cost Linux computer. Our whac-a-mole project shows the simplicity of getting started with this powerful system.
Experience and Support
Octavo Systems was founded by and is built around industry experts. We are leading the charge to bring System-In-Package technology to the masses. We have an experienced engineering staff that is ready to help guide you through adopting this innovative technology into your application. We can’t wait to talk to you.
Headed to the show? Schedule a meeting with us to discuss your application.
Look forward to seeing you this year at Embedded World!