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Octavo Systems is bringing System-In-Package (SiP) Technology to the Embedded World Conference, February 27 – March 1, 2018 in Nuremberg, Germany. Our SiP technology enables you to build smaller more reliable systems, quicker and at a lower total system cost. Whether you are controlling large industrial machines, monitoring small vibrations along a fault, or building the next great web-connected consumer product, SiP can help you. Come to Hall 3A, Stand # 630 to discover how.
We will be demonstrating sample applications that benefit from our SiP technology. This is just a small subset of what can be done with this innovative technology. If you are curious to see if your application can benefit from SiP solution come by and see us.
Machine Vision and Industrial Control
Applications needing machine vision, number crunching might and precise control abilities are an easy task for the OSD335x SiP device. Exemplified with a Rubik’s cube solving robot, this demo using the BeagleBone Blue, shows an industrial control application in a miniature form. The device can handle many sensor inputs and produce more than 50 PWM signals, making it the optimum solution for control. More info.
IoT and Sensors
Bringing together many sensor inputs in your IoT application? System-In-Package technology gives you a perfect resource to aggregate and control a variety of inputs and outputs simultaneously in a tiny package. The OSD3358-SM-RED development platform provides an easy to use reference design to get you started. More info.
Commercial and General Computing
Get to market quickly with a low cost development platform. PocketBeagle® featuring The OSD335x-SM, gives developers access to the performance and compact size of System-In-Package at only $25. At only 35mm x 55mm it’s the smallest and lowest cost Linux computer. Our whac-a-mole project shows the simplicity of getting started with this powerful system.
Experience and Support
Octavo Systems was founded by and is built around industry experts. We are leading the charge to bring System-In-Package technology to the masses. We have an experienced engineering staff that is ready to help guide you through adopting this innovative technology into your application. We can’t wait to talk to you.
Octavo Systems is bringing System-In-Package (SiP) Technology to the Embedded World Conference, February 27 – March 1, 2018 in Nuremberg, Germany. Our SiP technology enables you to build smaller more reliable systems, quicker and at a lower total system cost. Whether you are controlling large industrial machines, monitoring small vibrations along a fault, or building the next great web-connected consumer product, SiP can help you. Come to Hall 3A, Stand # 630 to discover how.
We will be demonstrating sample applications that benefit from our SiP technology. This is just a small subset of what can be done with this innovative technology. If you are curious to see if your application can benefit from SiP solution come by and see us.
Machine Vision and Industrial Control
Applications needing machine vision, number crunching might and precise control abilities are an easy task for the OSD335x SiP device. Exemplified with a Rubik’s cube solving robot, this demo using the BeagleBone Blue, shows an industrial control application in a miniature form. The device can handle many sensor inputs and produce more than 50 PWM signals, making it the optimum solution for control. More info.
IoT and Sensors
Bringing together many sensor inputs in your IoT application? System-In-Package technology gives you a perfect resource to aggregate and control a variety of inputs and outputs simultaneously in a tiny package. The OSD3358-SM-RED development platform provides an easy to use reference design to get you started. More info.
Commercial and General Computing
Get to market quickly with a low cost development platform. PocketBeagle® featuring The OSD335x-SM, gives developers access to the performance and compact size of System-In-Package at only $25. At only 35mm x 55mm it’s the smallest and lowest cost Linux computer. Our whac-a-mole project shows the simplicity of getting started with this powerful system.
Experience and Support
Octavo Systems was founded by and is built around industry experts. We are leading the charge to bring System-In-Package technology to the masses. We have an experienced engineering staff that is ready to help guide you through adopting this innovative technology into your application. We can’t wait to talk to you.
When most of us think of Artificial Intelligence (AI) we think of large server farms doing complex calculations. In this paradigm for a product to leverage AI it would need to connect and send data to these servers to do their AI magic and then return the answer to the device, similar to Alexa. However, with the continued advancements in performance along with the reduction of size and power of processors, like the OSD32MP1 System-in-Package (SiP) featuring the STM32MP1, it is possible to run AI algorithms right on the local product, at the Edge.
The MPCAM from Siana Systems is an example of just such a platform. Featuring the OSD32MP1 SiP it is a platform that does Computer Vision (CV) at the edge. (Read More…)
Octavo Systems is bringing System-In-Package (SiP) Technology to the Embedded World Conference, February 27 – March 1, 2018 in Nuremberg, Germany. Our SiP technology enables you to build smaller more reliable systems, quicker and at a lower total system cost. Whether you are controlling large industrial machines, monitoring small vibrations along a fault, or building the next great web-connected consumer product, SiP can help you. Come to Hall 3A, Stand # 630 to discover how.
We will be demonstrating sample applications that benefit from our SiP technology. This is just a small subset of what can be done with this innovative technology. If you are curious to see if your application can benefit from SiP solution come by and see us.
Machine Vision and Industrial Control
Applications needing machine vision, number crunching might and precise control abilities are an easy task for the OSD335x SiP device. Exemplified with a Rubik’s cube solving robot, this demo using the BeagleBone Blue, shows an industrial control application in a miniature form. The device can handle many sensor inputs and produce more than 50 PWM signals, making it the optimum solution for control. More info.
IoT and Sensors
Bringing together many sensor inputs in your IoT application? System-In-Package technology gives you a perfect resource to aggregate and control a variety of inputs and outputs simultaneously in a tiny package. The OSD3358-SM-RED development platform provides an easy to use reference design to get you started. More info.
Commercial and General Computing
Get to market quickly with a low cost development platform. PocketBeagle® featuring The OSD335x-SM, gives developers access to the performance and compact size of System-In-Package at only $25. At only 35mm x 55mm it’s the smallest and lowest cost Linux computer. Our whac-a-mole project shows the simplicity of getting started with this powerful system.
Experience and Support
Octavo Systems was founded by and is built around industry experts. We are leading the charge to bring System-In-Package technology to the masses. We have an experienced engineering staff that is ready to help guide you through adopting this innovative technology into your application. We can’t wait to talk to you.
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