OSD62-PM System-in-Package

AM62 + DDR4 in a Small Flexible Package

Sign Up to Learn More

The new OSD62x-PM System-in-Package (SiP) family of devices empowers designers utilizing the Texas Instruments AM62x processors to get their design to market faster and in smallest form factor.

The OSD62-PM System-in-Package (SiP) integrates the AM62x, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD62-PM offers the full functionality of the AM62 in a significantly smaller form factor, making it suitable for new, space-constrained applications.

Related Products

  • OSD62 – AM62, DDR, PMIC, EEPROM, Oscillator, Passives in a in a 21mm X 21mm Package

 

  • Integrated into a 9mm X 14mm BGA Package:
  • AM62 Features:
    • Up to 4x Arm® Cortex®-A53 @1.4GHz
    • Arm® Cortex®-M4F
    • Display subsystem
      • Supports 2x 1920×1080 @ 60fps
      • OLDI/LVDS (4 lanes – 2x) and 24-bit RGB parallel
        interface
    • 3D Graphics Processing Unit
      •  Supports up to 2048×1080 @60fps
      • OpenGL ES 3.1, Vulkan 1.2
  • Access to All AM62 Peripherals Including:
    • MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
    • 10/100/1000 Ethernet Switch
    • Support for Time Sensitive Networking (TSN)
    • 2x USB2.0 Ports
    • 9x UART, 5x SPI, 6x I2C, 3x McASP
    • 3x ePWM, 3x eQEP, 3x eCAP
    • 3x CAN-FD
    • 1x eMMC, 2x SDIO, 1x GPMC
  • Package Options:
    • 9mm X 14mm (0.35in X 0.55in) 500 Ball BGA
    • 0.5mm BGA spacing
  • Temperature Rating
    • -40° to 85° C case

 

Family Overview

OSD62-PM Family Overview | Version: 1.0 | June 13, 2024

What Our Customers are Saying: