The new OSD62x-PM System-in-Package (SiP) family of devices empowers designers utilizing the Texas Instruments AM62x processors to get their design to market faster and in smallest form factor.
The OSD62-PM System-in-Package (SiP) integrates the AM62x, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD62-PM offers the full functionality of the AM62 in a significantly smaller form factor, making it suitable for new, space-constrained applications.
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The OSD62-PM-BRK is the official open-hardware development platform for the OSD62x-PM System-in-Package (SiP). This compact 4-inch by 1.2-inch (101.6mm x 30.48mm) board is designed for maximum flexibility and ease of use, providing direct access to every I/O of the AM62 processor inside the OSD62-PM. By leveraging the integration and size savings of the OSD62-PM, engineers can dramatically reduce PCB complexity and overall footprint, enabling smaller, more efficient designs without sacrificing performance.