OSD62 Family

Overview

Products

ProductOSD62x
Description

The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the AM62x processors to get to their design to market faster and in a smaller form factor.  It  enables them to build the next generation of  building and industrial automation/control,  IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus features that will differentiate their product instead of getting the spending time getting the processor to function.

ProcessorTexas Instruments AM62x
MemoryLPDDR4
Additional IntegrationLPDDR4
Power Management
EEPROM
Oscillator
Passives
Optional Integration
Temperature Range0 to 85C
-40 to 85C
Package Size22mm X 22mm - 480 Ball BGA or 9mm X 14mm - 450 Ball BGA
DetailsView Details