Product | OSD62x | |
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Description | The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the AM62x processors to get to their design to market faster and in a smaller form factor. It enables them to build the next generation of building and industrial automation/control, IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus features that will differentiate their product instead of getting the spending time getting the processor to function. | |
Processor | Texas Instruments AM62x | |
Memory | LPDDR4 | |
Additional Integration | LPDDR4 Power Management EEPROM Oscillator Passives Optional Integration | |
Temperature Range | 0 to 85C -40 to 85C | |
Package Size | 22mm X 22mm - 480 Ball BGA or 9mm X 14mm - 450 Ball BGA | |
Details | View Details |