OSD62x: Texas Instruments AM62x based System-in-Package

Ease, Speed, Performance, Size

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The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the Texas Instruments AM62x processors to get their design to market faster and in a smaller form factor.  It  enables them to build the next generation of  building and industrial automation/control,  IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus on features that will differentiate their product instead of spending time getting the processor to function.

The OSD62x integrates the AM62x processor, LPDDR4, Power Management, EEPROM, Oscillators, and Passives into a single package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your AM62 based design.  It is the fastest, smallest, and most cost effective way to implement an AM62 system.

Related Products

  • OSD62-PM – AM62x, DDR, Passives in a in a tiny 9mm X 14mm Package

 

  • Integrated into a 21mm X 21mm BGA Package:
  • AM62 Features:
    • Up to 4x Arm® Cortex®-A53 @1.4GHz
    • Arm® Cortex®-M4F
    • Display subsystem
      • Supports 2x 1920×1080 @ 60fps
      • OLDI/LVDS (4 lanes – 2x) and 24-bit RGB parallel
        interface
    • 3D Graphics Processing Unit
      • Supports up to 2048×1080 @60fps
      • OpenGL ES 3.1, Vulkan 1.2
  • Access to All AM62 Peripherals Including:
    • MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
    • 10/100/1000 Ethernet Switch
    • Support for Time Sensitive Networking (TSN)
    • 2x USB2.0 Ports
    • 9x UART, 5x SPI, 6x I2C, 3x McASP
    • 3x ePWM, 3x eQEP, 3x eCAP
    • 3x CAN-FD
    • 1x eMMC, 2x SDIO, 1x GPMC
  • Power Supply
    • Single (3.3V) voltage Input
    • All Power sequencing handled internal to SiP
    • Rails available for system user.
  • Package Options:
    • 21mm X 21mm (0.827in X 0.827in) 437 Ball BGA
    • 1.0mm BGA spacing
  • Temperature Rating
    • 0° to 85° C case
    • -40° to 85° C case

 

Family Overview

OSD62 Family Overview | Version: | September 21, 2024

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