OSD32MP2 System-in-Package

The Quickest and Most Cost-effective way to develop with the STM32MP2

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The OSD32MP2x System-in-Package (SiP) integrates the STMicroelectronics STM32MP2 processor with DDR4 memory, STPMIC2 PMIC, EEPROM, Oscillators and passives into a compact 21mm x 21mm BGA package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your STM32MP2 based design.  It is the fastest, smallest, and most cost effective way to implement a STM32MP2 system.

Related Products

  • OSD32MP2-PM – STM32MP2, DDR, Passives in a in a tiny 9mm X 14mm Package

 

  • Integrated into a 21mm X 21mm BGA Package:
  • STM32MP2 Features:
    • Up to 2x Arm® Cortex®-A35 @1.5GHz
    • Arm® Cortex®-M33 @ 400MHz
    • AI Neural Processing Unit
      • 35 TOPS
    • 3D Graphics Processing Unit
      • OpenGL ES 3.1, Vulkan 1.1, OpenCL 1.2
  • Access to All STM32MP2 Peripherals Including:
    • 8× I2C FM+ (1 Mbit/s, SMBus/PMBus®)
    • 4× I3C (12.5 Mbit/s)
    • 5× UART + 4× USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI) + 1× LPUART
    • 8× SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
    • 4× SAI (stereo audio: I2S, PDM, SPDIF Tx)
    • SPDIF Rx with 4 inputs
    • 3× SDMMC up to 8-bit (SD/e•MMC™/SDIO)
    • Up to 3× CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
    • 1× USB 2.0 high-speed Host with embedded 480 Mbits/s PHY
    • 1× USB 2.0/3.0 high-speed/SuperSpeed dual role data with embedded 480 Mbits/s and 5 Gbits/s PHY (5 Gbits/s PHY shared with PCI Express)
    • 1× USB Type-C® Power Delivery control with two CC lines PHY
    • 1 × PCI Express with embedded 5 Gbits/s PHY (PHY shared with USB 3.0 SuperSpeed)
    • Up to 3× Gigabit Ethernet interfaces
      • TSN, IEEE 1588v2 hardware
    • Camera interface #1 (5 Mpixels @30 fps)
      • MIPI CSI-2®, 2× data lanes up to 2.5 Gbit/s each
      • 8- to 16-bit parallel, up to 120 MHz
      • RGB, YUV, JPG, RawBayer with basic ISP
      • Lite-ISP, demosaicing, downscaling, cropping, 3 pixel pipelines
    • Camera interface #2 (1 Mpixels @15 fps)
      • 8- to 14-bit parallel, up to 80 MHz
      • RGB, YUV, JPG
      • Cropping
    • Digital parallel interface up to 16-bit input or output
    • 3 × ADCs with 12-bit max. resolution (up to 5 Msps each, up to 23 channels)
    • Internal temperature sensor (DTS)
    • 1× multifunction digital filter (MDF) with up to 8 channels/8 filters
    • 1× audio digital filter (ADF) with 1 filter and sound activity detection
    • Internal (VREFBUF) or external ADC reference VREF+
  • 21mm X 21mm (0.827in X 0.827in) BGA
    • 437 Ball
    • 1.0mm BGA spacing
  • Temperature Rating
    • 0° to 85° C case
    • -40° to 85° C case

Family Overview

OSD32MP2 Family Overview | Version: 1.0 | April 04, 2024

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