Octavo Highlights From Embedded World 2019!
February 26-28, 2019 in Nuremberg, Germany
More people than ever before are realizing the value of System-In-Package (SiP) Technology for a wide array of applications. Thanks to everyone that visited our booth at the 2019 Embedded World Conference. This year we had more space, more visitors and more exciting announcements. From the new ST32MP1 SiP to the AM335x-Based OSD335x C-SiP™ , Octavo’s System in Package technology simplifies the design of every-day products.
If you want to build smaller more reliable systems, quicker and at a lower total system cost, contact us. We’re here to help!
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Octavo Systems Marketing Manager, Greg Sheridan Discusses Benefits of SiP and New Products with Open Systems Media Editor Alix Paultre
Latest In System-in-Package Technology
OSD335x C-SiP™ – A Complete Computer in a 27mm Package
We demonstrated the latest addition to the OSD335x family, the OSD335x C-SiP™ which incorporates a COMPLETE 1 GHz computing system into a single, compact IC package the size of a standard LEGO BLOCK. Designers can add a complete computer capable of running Linux, Android, or an RTOS into any embedded design with just a handful of resistors.
OSD32MP15x – The First STM32MP1 based System-in-Package
Built around the new STM32MP1 from STMicroelectronics, the OSD32MP15x integrates the Dual Arm Cortex-A7 + M4 processor, the STPMIC1, DDR3 memory, EEPROM, MEMS Oscillators and passives into a single BGA the size of the processor itself. Download the datasheet and layout guide to learn more about the STM32MP1 and SiP technology create a platform to seamlessly migrates from a microcontroller to a Linux based MPU.
Exciting News Coverage at Embedded World
Electronic Specifier In this 3 minute interview with editor Mick Elliot, Octavo Systems CTO and visionary Gene Frantz sums it up. System Integration beyond Moore’s Law needs System in Package. Full article : | ||
ElectroMaker Octavo Systems Marketing Manager, Greg Sheridan shows editor Moe Long the C-SiP “Zero layer board Linux PC” and discusses how System in Package can shorten design time. Full article : |
EE Times Is Analog Signal Processing the Future of AI? by editor Nitin Dahad
Gene Frantz reveals the future of AI will be System in Package and Analog Signal Processing
Linux.com author and editor Eric Brown highlights that the new OSD32MP15x eases the transition for developers moving from STM32 MCUs to a Linux powered platform. ST’s new Cortex-A7 SoC to get the SiP treatment
EEWeb.Com editor Max Maxfield remarks about the STM32MP1 Based SiP: “The thing that really blows my socks off is that the OSD32MP1 package has the same 18 × 18-mm footprint as a standalone packaged STM32MP1” . Read the full article : Octavo Systems Introduces First STM32MP1-Based SiP
Electronic Design editor Bill Wong notes in his article System-in-Package Simplifies Multicore SoC Deployment that “the design savings provided by using the OSD32MP1 is significant, plus it offers a major footprint reduction.”
eeNews Europe editor Alistair Winning highlights the software support in his article First SiP for ST32M1 Line “The ability to re-use firmware and the elimination of complexity makes the OSD32MP1 the easiest path for designers to move from a microcontroller to Linux.”
The Connected Booth - IoT Gateway Demo Powered by System-in-Package
The entire Octavo Systems booth become a demonstration at Embedded World 2019. “The Connected Booth” showed the OSD335x System-in-Package Family in each of the roles of the IoT Gateway.
- Smart Sensors – The OSD335x System-in-Package can enable very small IoT sensors, managing inputs and outputs, make decisions and displaying at the node while also sending data to the gateway.
- Factory Automation – Precision control is exemplified by the OSD335x Rubik’s Cube Solving Robot
- Aggregator – With a Linux OS easily deployed, the OSD335x C-SiP is a complete System in a Package and provides everything you need for a “computer in a SiP”.
- Cloud – With a powerful 1GHz Cortex A-8 processor, the OSD335x manages data as a cloud device demonstrated by the OSD3358-SM-RED Reference, Evaluation, and Development board
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Look forward to seeing you this year at Embedded World!
