OSD32MP15x device failed after mounted on-board

[ML]

Hi all

We are have problems powering up our OSD32MP153C chip which we mounted (reflowed) onto our designed board.

A x-ray of the board was done and showed signs of BGA balls (which we think should be the DDR3L Memory that is residing within the SiP chip – OSD32MP153C) “de-flating” or “smurged”.

So we suspect the contact areas of these balls were affected during the reflow which led to no-contact of the internal component (DDR3L). Can we check what could have happen that causes the internal components (within the SiP chip) to be affected by our process? Many thanks in advance for any replies!

[Neeraj Dantu]

ML,

I suspect what you are seeing is a result of delamination of OSD32MP1 substrate. This can happen due to moisture absorption of the device resulting in rapid expansion of the absorbed moisture during reflow.

Please review sections 9.2 and 9.3 of the datasheet for storage and reflow requirements for OSD32MP1. It is possible to rework the board to replace OSD32MP1. Please make sure the reflow and storage requirements are followed.

Best,
Neeraj

[Author]

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