OSDZUx Family
Overview
The OSDZUx family of System-in-Package devices are the quickest way to harness the performance and flexibility of the AMD Zynq UltraScale+ MPSoC architecture. Integrating the ZU MPSoC along with DDR, Power Supplies and other components removes many of the complexities found when designing with these flexible and powerful devices.
The OSDZUx devices will reduce your design time by months allowing you to get to market faster or spend more time adding features that will bring extra value to your customers.
Collateral
OSDZU3 Family Overview | Version: 15.0 | March 25, 2024A 1 page overview of the OSDZU3 System-in-Package family of devices
Products
| Product | OSDZU3-REF | OSDZU3 | |
|---|---|---|---|
 |  | ||
| Description | The OSDZU3-REF is the official development platform for the AMD ZU3 System in Package, the OSDZU3. It provides a host of connectors and expansion headers providing an excellent foundation to evaluate the OSDZU3 in your application. It comes with a PetaLinux distribution that features a number of demos that allow you to get up and running in no time. | The OSDZU3 integrates the AMD Zynq Ultrascale+ MPSoC ZU3, LPDDR4 memory, 2x Infineon IRPS5401 PMICs, 2x LDOs, EEPROM, QSPI Flash, 2x Oscillators, and passives into a 40mm x 20.5mm 600 Ball BGA. | |
| Processor | AMD-Xilnx Zynq Ultrascale+ MPSoC ZU3 | ||
| Memory | Up to 2GB (16Gb) | ||
| Additional Integration | 2x Infineon IRPS5401 PMICs, 2x LDOs EEPROM, QSPI Flash 2x Oscillators Passives | ||
| Temperature Range | 0° to 85° C -40° to 85° C -40° to 105° C | ||
| Package Size | 40mm X 20.5mm - 600 Ball BGA | ||
A Powerful Development Platform for the OSDZU3 | Performance, Flexibility, and Simplicity | ||
| Details | View Details | View Details |