The OSD62-PM System-in-Package (SiP) integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD62-PM offers the full functionality of the AM62 in a significantly smaller form factor, making it suitable for new, space-constrained applications.

The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the AM62x processors to get to their design to market faster and in a smaller form factor.  It  enables them to build the next generation of  building and industrial automation/control,  IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus features that will differentiate their product instead of getting the spending time getting the processor to function.

AM62 + DDR4 in a Small Flexible Package

The Quickest and Most Cost-effective way to develop with the AM62