OSD335x Family of System-In-Package Devices- Octavo Systems

OSD335x Family

Overview

The OSD335x family is the perfect solution for any designer looking to quickly integrate the Texas Instruments AM335x into their product using the smallest possible footprint.

Collateral

OSD335x Family Overview | Version: 11 | March 01, 2022

A 2 page overview of the entire OSD335x System-in-Package Family.

Product	OSD335x C-SiP	OSD335x-SM	OSD3358-SM-RED	OSD335x

Description	The OSD335x C-SiP is a Complete System-in-Package Device. It integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TL5209 LDO, TPS65217C PMIC, 4KB of EEPROM, eMMC non-volatile Storage, a MEMS Oscillator and all the needed passives, into a 27mm x 27mm 400 Ball BGA.	The OSD335x-SM integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TL5209 LDO, TPS65217C PMIC, all the needed passives, and 4KB of EEPROM into a 21mm x 21mm 256 Ball BGA.	The OSD3358-SM-RED is the Reference, Evaluation, Development board for the OSD335x families of System-In-Package devices. It is designed to enable quick evaluation of the OSD335x SiP, OSD335x-SM SiP and OSD335x C-SiP™. It has a number of common peripherals, sensors, and expansion connectors. All of the design documents are freely available so it can be used as a known good starting point for a new design.	The OSD335x integrates a TI Sitara ARM Cortex-A8 AM335x processor, up to 1GB of DDR3 memory, and a power management system into a single 27mm x 27mm 400 Ball BGA.
Processor	ARM® Cortex®-A8 AM335x Sitara™ from Texas Instruments	ARM® Cortex®-A8 AM335x Sitara™ from Texas Instruments		ARM® Cortex®-A8 AM335x Sitara™ from Texas Instruments
Memory	up to 1GB DDR3L	up to 1GB DDR3L		up to 1GB DDR3L
Additional Integration	4KB EEPROM MEMS Oscillator up to 16GB eMMC	4KB EEPROM
Temperature Range	0° to 85° C -40° to 85° C	0° to 85° C -40° to 85° C		0° to 85° C -40° to 85° C
Package Size	27mm X 27mm - 400 Ball BGA	21mm X 21mm - 256 Ball BGA		27mm X 27mm - 400 Ball BGA
	Most Integration	Smallest Design		Lowest Cost Integration
Details	View Details	View Details	View Details	View Details

Product

OSD335x-SM layout guide - AM335x based System in Package

TI AM335, TPS65217C, TL5209, DDR3, over 140 Passives in a single package.

Description

The OSD335x C-SiP is a Complete System-in-Package Device. It integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TL5209 LDO, TPS65217C PMIC, 4KB of EEPROM, eMMC non-volatile Storage, a MEMS Oscillator and all the needed passives, into a 27mm x 27mm 400 Ball BGA.

The OSD335x-SM integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TL5209 LDO, TPS65217C PMIC, all the needed passives, and 4KB of EEPROM into a 21mm x 21mm 256 Ball BGA.

The OSD3358-SM-RED is the Reference, Evaluation, Development board for the OSD335x families of System-In-Package devices. It is designed to enable quick evaluation of the OSD335x SiP, OSD335x-SM SiP and OSD335x C-SiP™. It has a number of common peripherals, sensors, and expansion connectors. All of the design documents are freely available so it can be used as a known good starting point for a new design.

The OSD335x integrates a TI Sitara ARM Cortex-A8 AM335x processor, up to 1GB of DDR3 memory, and a power management system into a single 27mm x 27mm 400 Ball BGA.

Processor

ARM® Cortex®-A8 AM335x Sitara™ from Texas Instruments

Memory

up to 1GB DDR3L

Additional Integration

4KB EEPROM
MEMS Oscillator
up to 16GB eMMC

4KB EEPROM

Temperature Range

0° to 85° C
-40° to 85° C

Package Size

27mm X 27mm - 400 Ball BGA

21mm X 21mm - 256 Ball BGA

27mm X 27mm - 400 Ball BGA

Most Integration

Smallest Design

Lowest Cost Integration

Details

View Details