OSD32MP2 Family

Overview

Products

ProductOSD32MP2xOSD32MP2x-PM
Description

The OSD32MP2x System-in-Package (SiP) integrates the STMicroelectronics STM32MP2 processor with DDR4 memory, STPMIC2 PMIC, EEPROM, Oscillators and passives into a compact 21mm x 21mm BGA package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your STM32MP2 based design.

The OSD32MP2x-PM System-in-Package (SiP) integrates the ST Microelectronics STM32MP2 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD32MP2x-PM offers the full functionality of the STM32MP2 in a significantly smaller form factor, making it suitable for new, space-constrained applications.

ProcessorSTMicroelectronics STM32MP25xSTMicroelectronics STM32MP25x
MemoryStarting at 1GB DDR4Starting at 1GB DDR4
Additional Integration- STMicroelectronics STM32MP2 processor
- DDR4 memory
- STPMIC2 PMIC
- EEPROM
- Oscillators
- Passives
- Passives
Temperature Range0° to 85° C
-40° to 85° C
0° to 85° C
-40° to 85° C
Package Size21mm X 21mm - 437 Ball BGA9mm X 14mm - 500 Ball BGA
The Quickest and Most Cost-effective way to develop with the STM32MP2
STM32MP2 + DDR4 in a Small Flexible Package
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