Octavo Systems @ Embedded World 2023
Octavo Systems is back at Embedded World!. We will be attending the show in Nuremberg, Germany March 14 – 16, 2023. Come learn about the latest in System-in-Package technology and how it can help you get to market faster while reducing the size of your solution. We will be showing off some of our latest technology at the Avnet Silica stand as well as the Texas Instruments stand. Stop by and see us or use the form below to request a meeting at the show. See You There!
Octavo Systems @ Avnet Silica
Stand 3A-111
Octavo Systems @ Texas Instruments
Stand 3A-215
See the OSDZU3 and the OSDZU3-REF development platform. The OSDZU3 is the latest System-in-Package from Octavo Systems built around the AMD-Xilinx Zynq UltraScale+ MPSoC, that simplifies the design of high end automation, control, image processing, and many more applications. The OSDZU3 Integrates:
- AMD-Xilinx ZU3
- LPDDR4
- Complete Power Management System
- QSPI
- EEPROM
- Oscillators
- Passives
in a 20.5mm x 40mm BGA.
Something new is coming. Check back on March 14th to find out the latest, or come stop by the TI stand.
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Meet With Us!!!
Thank you for the great event!