Forums › Devices › OSD335x C-SiP › OSD335x C-SIP BGA ball size and landing pad size
The C-SIP layout guide indicates a landing pad size of 0.5mm while the Altium footprint contained in your library has pads at 0.6mm diameter.
Why the difference?
Did a pad size of 0.5mm not work out?
Sktz,
As described in the layout guide:Â https://octavosystems.com/app_notes/osd335x-c-sip-layout-guide/, the landing pad size is 0.5mm.
Thank you for pointing it out that the Altium symbol has a different landing pad size. We will rectify that ASAP.
best,
Neeraj
Octavo Systems LLC all rights reserved
OCTAVO is registered in the U.S. Patent and Trademark Office. OSD, C-SiP, and the Octavo Logo are trademarks of Octavo Systems LLC.
"*" indicates required fields
"*" indicates required fields
"*" indicates required fields
"*" indicates required fields