OSD335x-SM data sheet

Tagged: OSD3358-SM-RED, OSD335x-SM data sheet

This topic has 2 replies, 3 voices, and was last updated 6 years, 10 months ago by Erik Welsh.

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- December 12, 2017 at 3:01 pm #4163
  Chadz00
  Participant
  Hi there,
  I’m trying to build different development flat form using OSD335x-SM package.As per the OSD335x-SM data sheet(page 5) 2.1 passive component description status different value when looking at the OSD3358-SM-RED board schematic diagram fora instant OSD3358-SM data sheet recommend that VIN_AC/VIN_USB/VIN_BAT should connect with 10uF cap but OSD3358-SM-RED board schematic diagram connect with 220uF. can you please advice that what values will give optimum output with OSD335x-SM package please?
  Cheers!!
  - This topic was modified 6 years, 10 months ago by Chadz00.
- December 12, 2017 at 5:40 pm #4166
  Greg Sheridan
  Keymaster
  Moved to the SM device category.
- December 12, 2017 at 7:03 pm #4167
  Erik Welsh
  Keymaster
  Table 2.1 of the OSD335x-SM datasheet describes the passive components that are contained within the SiP that you need to be aware of from a design perspective. This is not the recommended amount of capacitance on the given pin but the amount of capacitance that is already there.
  The amount of additional capacitance that you add to your input and output power rails depends on your design. For example, the OSD335x-SM-RED design adds a number of components for input power protection as well as a large capacitor in case of power stability issues from the AC adapter. You need to have stable power planes so add bulk capacitance to places where you feel you need additional help to make sure that you maintain stable power planes.
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