OSD Family

Overview

The Octavo Subsystem Device (OSD) Family is our first line of products for the mass market.  The products in this family integrate key components from common subsystems used in different industries.  The subsystem consists of at least a processor, RAM, and a power system.  The OSD Family of devices aims to greatly decrease the time it takes to get a product to market by integrating a lot of the key components into an easy to use package.

Products

ProductOSD62x-PMOSD32MP2xOSD32MP2x-PMOSD62xOSDZU3-REFOSDZU3OSD32MP1-BRKOSD32MP1-REDOSD32MP15xOSD335x C-SiP
ST Micro System in Package OSD32MP15x based on STM32MP1OSD335x C-SiP - AM335x based System in Package Detailed Block Diagram
Description

The OSD62-PM System-in-Package (SiP) integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD62-PM offers the full functionality of the AM62 in a significantly smaller form factor, making it suitable for new, space-constrained applications.

The OSD32MP2x System-in-Package (SiP) integrates the STMicroelectronics STM32MP2 processor with DDR4 memory, STPMIC2 PMIC, EEPROM, Oscillators and passives into a compact 21mm x 21mm BGA package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your STM32MP2 based design.

The OSD32MP2x-PM System-in-Package (SiP) integrates the ST Microelectronics STM32MP2 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD32MP2x-PM offers the full functionality of the STM32MP2 in a significantly smaller form factor, making it suitable for new, space-constrained applications.

The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the AM62x processors to get to their design to market faster and in a smaller form factor.  It  enables them to build the next generation of  building and industrial automation/control,  IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus features that will differentiate their product instead of getting the spending time getting the processor to function.

The OSDZU3-REF is the official development platform for the AMD ZU3 System in Package, the OSDZU3. It provides a host of connectors and expansion headers providing an excellent foundation to evaluate the OSDZU3 in your application. It comes with a PetaLinux distribution that features a number of demos that allow you to get up and running in no time.

The OSDZU3 integrates the AMD Zynq Ultrascale+ MPSoC ZU3, LPDDR4 memory, 2x Infineon IRPS5401 PMICs, 2x LDOs, EEPROM, QSPI Flash, 2x Oscillators, and passives into a 40mm x 20.5mm 600 Ball BGA.

The OSD32MP1-BRK is a small flexible prototyping platform for the STM32MP1 based SiP, the OSD32MP15x.  At only 3in X 1.8in (75mm X 46mm), provides easy access to the I/O of the STM32MP1 through a set of breadboard compatible headers.  The OSD32MP1-BRK allows developers to quickly build a proof of concept that more closely resembles their actual system without the need to build their own custom hardware.

The OSD32MP1-RED is the Reference, Evaluation, Development platform for the OSD32MP15x family of SiP devices. It is designed to enable quick evaluation of the OSD32MP15x in your specific application. It has a number of industry standard connectors, plus access to a host of peripherals, and connectivity options including WiFi and Bluetooth. Running a completely opensource Debian Distribution the OSD32MP1-RED allows quick prototyping in both hardware and software.

All of the hardware design files and software are freely available as Opensource so it can be used as a known good starting point for new designs.

The OSD32MP15x integrates the STMicroelectronics STM32MP1 featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4 along with up to 1GB DDR3, STPMIC1 Power Management IC, EEPROM, MEMS Oscillator, and passives into single 18mm x 18mm BGA package.

The OSD335x C-SiP is a Complete System-in-Package Device. It integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TL5209 LDO, TPS65217C PMIC, 4KB of EEPROM, eMMC non-volatile Storage, a MEMS Oscillator and all the needed passives, into a 27mm x 27mm 400 Ball BGA.

ProcessorTexas Instruments AM62xSTMicroelectronics STM32MP25xSTMicroelectronics STM32MP25xTexas Instruments AM62xAMD-Xilnx Zynq Ultrascale+ MPSoC ZU3STM32MP15x Dual Core Arm® Cortex® A7 plus an Arm® Cortex® M4ARM® Cortex®-A8 AM335x Sitara™ from Texas Instruments
MemoryStarting at 1GB DDR4Starting at 1GB DDR4Starting at 1GB DDR4Starting at 1GB DDR4Up to 2GB (16Gb)up to 1GB DDR3up to 1GB DDR3L
Additional Integration- Passives- STMicroelectronics STM32MP2 processor
- DDR4 memory
- STPMIC2 PMIC
- EEPROM
- Oscillators
- Passives
- Passives- Power Management
- EEPROM
- Oscillator
- Passives
- Optional Integration
2x Infineon IRPS5401 PMICs, 2x LDOs
EEPROM, QSPI Flash
2x Oscillators
Passives
4KB EEPROM, MEMS Oscillator and over 100 supporting passives4KB EEPROM
MEMS Oscillator
up to 16GB eMMC
Temperature Range-40° to 85° C0° to 85° C
-40° to 85° C
0° to 85° C
-40° to 85° C
0 to 85C
-40 to 85C
0° to 85° C
-40° to 85° C
-40° to 105° C
0° to 85° C
-40° to 85° C
0° to 85° C
-40° to 85° C
Package Size9mm X 14mm - 500 Ball BGA21mm X 21mm - 437 Ball BGA9mm X 14mm - 500 Ball BGA21mm X 21mm - 437 Ball BGA40mm X 20.5mm - 600 Ball BGA18mm X 18mm - 302 Ball BGA27mm X 27mm - 400 Ball BGA
AM62 + DDR4 in a Small Flexible Package
The Quickest and Most Cost-effective way to develop with the STM32MP2
STM32MP2 + DDR4 in a Small Flexible Package
The Quickest and Most Cost-effective way to develop with the AM62
A Powerful Development Platform for the OSDZU3
Performance, Flexibility, and Simplicity
Flexible Prototyping Platform
Full Featured Development Platform
First STM32MP15x System in Package
Most Integration
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