Published On: January, 25, 2019 By: Eshtaartha Basu
The temperature of a device during operation in a system is an important parameter as it affects many properties such as device functionality, reliability and life. Since OSD335x C-SiP is a System-in-Package (SiP) with several ICs and passive components, single IC package data cannot be used to estimate its thermal characteristics. Hence, it was necessary to characterize OSD335x C-SiP for its thermal behavior.
This document will provide thermal characteristics of OSD335x C-SiP and a way to estimate junction temperature. We will also give a comparison of OSD335x C-SiP with a similar system of discrete components.
1. Introduction
2. Revision History
3. OSD335x C-SiP Thermal Parameters
4. Measuring Case Temperature and Estimating Junction Temperature of the OSD335x C-SiP
A PDF version of this App Note can be found here.
Revision Number | Revision Date | Changes | Author |
---|---|---|---|
1 | 1/18/19 | Â Initial Release | Â E. Basu |
The measured Thermal Parameters of OSD335x C-SiP are given in Table 1.
(1)Â Â is the measured Thermal Resistance from Junction to Top of Package as measured above the CPU when the SiP is mounted on a 4 layer board (34mm x 32mm OSD335x C-SiP SOM mounted on the 133mm x 55mm IOT Baseboard) in still air and CPU under maximum load, and other components operating per spec.
(1)Â Â is the measured Thermal Resistance from Junction to Ambient Air when the SiP is mounted on a 4 layer board (34mm x 32mm OSD335x C-SiP SOM mounted on the 133mm x 55mm IOT Baseboard) in still air and CPU under maximum load, and other components operating per spec.
To measure the case temperature of OSD335x C-SiP:
It may be desirable to estimate the Junction Temperature (TJ) of the AM3358 Die inside the System-in-Package. In this case it can be estimated with the following equation:
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