Everybody looking for an easy way to add a powerful Embedded Linux Computer to your design, today is your lucky day. The OSD335x Complete System-in-Package (C-SiP) is now available through all our standard distribution channels or direct from Octavo.
Developed by an Industry Expert the open source reference design has everything you need to develop a building automation controller. This design features the OSD335x C-SiP which integrates an entire Embedded Linux system into a single IC, Relays, Analog Sensor inputs, RS-485, CAN and many other features required in industrial and building automation environments.
We are excited to share the news of our first demo of the STM32MP1 System in Package, the OSD32MP15x.
Surprisingly the hardest part of creating a new product is taking a working prototype and ramping into production. It is more complex than the architecture of the system, the hardware and software design, creating a working prototype, or taking the system through certification/qualification. The reason is simple; production requires discipline, logistics, and manufacturing at large volumes, where simple mistakes can be very expensive.
Smoothly ramping a new product into production is always the goal but seldom the reality. While it may be convenient to start thinking about production once the prototype is working, this will lead to many headaches. Successfully ramping into production starts its journey very early in the process. That means it requires paying attention to the details all the way through the process, starting with the system architecture. One thing we have learned by taking many products into production:
“Just because you can build 1 doesn’t mean you can build 10. Just because you can build 10 doesn’t mean you can build 100. And this continues with each order of magnitude.”
This paper discusses some of the insights an aids that we at Octavo have learned over the years to help you minimize the issues as you design and ramp your product into production.
The Heating, Ventilation and Air Conditioning (HVAC) market is expected to reach over $130B in the next five years. Driven by the rise in construction globally, plus refurbishment of homes and businesses, the demand to put in new units is increasing rapidly. Smarter equipment with more sensors, higher efficiency, reliability and ease of maintenance are priorities for new designs. As with most rapidly growing electronics markets, the need for fast turnaround of embedded systems designs while maintaining cost controls and increasing features is critical to a strong go to market strategy. Increasingly these systems also need be configured and controlled based on information being received in real time. In order to keep up with the rapid rate at which technology is transforming the HVAC industry, design engineers need a flexible platform on which they can spend time developing the features that make their application unique and efficient, and not have to channel valuable resources into tedious complexities such as power management and DDR routing. They also need reliable, open source hardware and software design tools. The OSD335x-SM System in Package based on the TI AM335x, is the perfect solution as it provides engineers the solid foundation that they need. With the availability of low cost development tools, such as PocketBeagle® from BeagleBoard.org®, rapid prototyping HVAC features is easy. (Read More…)
Whether you use OrCAD, Eagle or Altium, we’ve just released a library containing our OSD32MP1 , the STM32MP1 System in Package device. Download all of the OSD32MP1 SiP, STM32MP1 Schematic Symbol and STM32MP1 Footprint files in one place.
You might have seen the OSD32MP1 System in Package (SiP) built around the new STM32MP1 microprocessor from ST Micro and wondered, “Why should I care? I’ve been using microcontrollers for years- I’m an expert at programming bare metal, a regular register ninja.” In this article, I will paint a picture of why even the simplest of microcontroller applications can benefit from the Octavo STM32MP1 System in Package.
The July 2019 Newsletter includes an exciting industry award announcement plus new application notes for AM335x on ethernet and industrial control as well as CubeMX software for STM32MP1.
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Our latest System-in-Package device built around the new STMicroelectronics STM32MP1 microprocessor has won the Highly Commended Award for Embedded Solutions at the Electronics Industry Awards.
It is crazy to think that just 3 years ago we released our first SiP built around the popular AM335x microprocessor from Texas Instruments. We have since spread the word that System-in-Package is no longer a solution reserved for the large, well-funded companies, but that any designer can take advantage of System-in-Package Technology via solutions from Octavo Systems. Now with this recognition from the Electronics Industry Awards, it appears this message is gaining traction.
We have exciting updates to share about our STM32MP1 activity. Click on each to learn more:
1.STM32MP1 SiP Launch Update
2.Updates on Tech Docs
3.Request for Your Input on our Reference Design – Join Octavo Alpha Community!
4.Visit Us at the Upcoming ST Tech Tour
5. Support Forums Launched