Embedded World is just over 2 Weeks away! If you’re like us, you’re busy putting together a plan to navigate the world’s largest trade show dedicated to embedded systems. Having attended for several years, we’ve gathered some key insights to help you make the most of your time at the show.
We are thrilled to announce our participation in Embedded World 2025, taking place on March 11, 12, and 13 in Nuremberg, Germany. As the leading event for embedded systems designers, this show is the perfect opportunity to explore how cutting-edge technology like System-in-Package can help you deliver next-generation products faster and connect with industry experts.
Discover the Latest in System-in-Package Technology (Read More…)
The Consumer Electronics Show (CES) is always a whirlwind of innovation, hype, and surprises. After decades in the semiconductor industry and a lifelong technology geek, I’ve developed a sense for identifying both the trends with staying power and those that might just be clever marketing spins. This year, CES didn’t disappoint, and I want to share my takeaways on a few themes that stuck with me—AI and robotics– and spotlight on one of our customers, Fasetto, Inc. (Read More…)
The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.
For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial.
(Read More…)It’s the heart of the summer and too hot to go outside, so why not stay in and work on a new project with the OSD32MP1-BRK.
Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in-Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in-Package while delivering the performance and flexibility expected from the Zynq UltraScale+ architecture. (Read More…)
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When most of us think of Artificial Intelligence (AI) we think of large server farms doing complex calculations. In this paradigm for a product to leverage AI it would need to connect and send data to these servers to do their AI magic and then return the answer to the device, similar to Alexa. However, with the continued advancements in performance along with the reduction of size and power of processors, like the OSD32MP1 System-in-Package (SiP) featuring the STM32MP1, it is possible to run AI algorithms right on the local product, at the Edge.
The MPCAM from Siana Systems is an example of just such a platform. Featuring the OSD32MP1 SiP it is a platform that does Computer Vision (CV) at the edge. (Read More…)