Product | OSD62-PM-BRK | OSD62x-PM | OSD62x | |
---|---|---|---|---|
![]() | ![]() | ![]() | ||
Description | The OSD62-PM-BRK is a small open hardware flexible development platform for the OSD62x-PM SiP, the Texas Instruments AM62 based SiP. At only 4in X 1.2in (101.6mm X 30.48mm), it provides easy access to all the I/O of the AM62 through standard headers. The OSD62-PM-BRK allows developers to quickly build a proof of concept that more closely resembles their actual system without the need to build their own custom hardware. | The OSD62-PM System-in-Package (SiP) integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD62-PM offers the full functionality of the AM62 in a significantly smaller form factor, making it suitable for new, space-constrained applications. | The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the AM62x processors to get to their design to market faster and in a smaller form factor. It enables them to build the next generation of building and industrial automation/control, IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus features that will differentiate their product instead of getting the spending time getting the processor to function. | |
Processor | OSD6254-1G-IPM | Texas Instruments AM62x | Texas Instruments AM62x | |
Memory | 1GB | Starting at 1GB DDR4 | Starting at 1GB DDR4 | |
Additional Integration | - Passives | - Power Management - EEPROM - Oscillator - Passives - Optional Integration | ||
Temperature Range | -40° to 85° C | 0 to 85C -40 to 85C | ||
Package Size | 9mm X 14mm - 500 Ball BGA | 21mm X 21mm - 437 Ball BGA | ||
AM62 + DDR4 in a Small Flexible Package | The Quickest and Most Cost-effective way to develop with the AM62 | |||
Details | View Details | View Details | View Details |