Robots, Games, IoT, and Tiny Computers – Example Applications from the Embedded Systems Conference in Boston Last week was a
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- Austin, TX
- 512-861-3400
Robots, Games, IoT, and Tiny Computers – Example Applications from the Embedded Systems Conference in Boston Last week was a
New Smaller More Flexible OSD335x-SM System-In-Package Octavo Systems Announces 40% Smaller SiP to OSD335x Family Austin, Texas (May 2, 2017)
PocketBone: The Linux Computer that Fits in a Mini-Altoids Tin – Designed in KiCad – Featuring the OSD3358 This article
Visit Octavo Systems at the Embedded Systems Conference 2017 in Boston Octavo Systems is heading to Boston! We will be
Robots are everywhere. Self-guided vacuums cruise across our floors. Manufacturing robots construct cars and appliances with speed and precision. Self–driving
Why System in Package Technology Must Replace System on a Chip Technology System on a chip (SoC) technology has got us
Now Even More Ways to Buy Octavo’s Products I have another exciting announcement to make! We are expanding our distribution network, giving
New OSD335x-SM Reference Design Tutorials Give Engineers Full Design Instructions & Practice How can you simplify your design process and
New OSD3358 Development Platforms from GHI Electronics It has been a busy couple of weeks around here lately with a
The BeagleBone® Black Wireless and BeagleBoard Compatibility Today is a very exciting day! After months of hard work, we are
Octavo Systems is heading to Embedded World North America 2026 in Anaheim, California, September 22–24. Meet our team and get the latest updates on the OSD62x-PM, OSD32MP2x-PM, and System-in-Package technology.
The Practical Guide to Product Development with SiPs Most articles about System-in-Package devices stop at the definition. This one starts
Recognizing Innovation: OSD62x-PM Shortlisted at the Elektra Awards We are proud to announce that Octavo Systems has been named a
Independent platforms are taking a closer look at our newest System-in-Package, the OSD62x-PM—and the feedback is exciting. Recently, Electromaker published a
We Just Launched the OSD62x-PM – Our Smallest SiP Yet We’re excited to share that our newest System-in-Package Module, the OSD62x-PM, is
From Prototype to Production: How Octavo Systems Accelerates Product Development In the embedded world, the journey from prototype to production
Meet the Minds Behind Octavo: How Innovation and Experience Drive Our Mission At Octavo Systems, we believe simplifying embedded design
In the world of embedded systems, performance, scalability, and simplicity often feel like trade-offs. But what if you didn’t have
In industrial automation, robotics, and autonomous systems, timing isn’t just important—it’s everything. Devices need to respond with split-second accuracy, communicate
Welcome to the inaugural edition of Embedded Insights, where we explore how System-in-Package (SiP) technology is accelerating product development across industries.
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.
