Hardware Failures on custom boards using OSD32MP157C-512M-IAA.

[Maxime Gaschet]

Dear Octavo Support Team,

We are currently validating a batch of 16 boards manufactured, which utilize the OSD32MP157C-512M-IAA component, they are labeled MK-1 to MK-16. During our initial power-on and boot tests, we identified several critical hardware failures across 9 units.

We would appreciate your technical insights and guidance on the following observed issues:

– DDR Memory Access Failure (Unit MK-1): The system reports a DDR address bus test error: can’t access memory @ 0xc000000.

NOTICE:  CPU: STM32MP157F?? Rev.Z
NOTICE:  Model: Desvac Needleless (based on SIS2 module)
INFO:    PMIC version = 0x21
NOTICE:  Reset reason (0x15):
INFO:      Power-on Reset (rst_por)
INFO:    FCONF: Reading TB_FW firmware configuration file from: 0x2ffe2000
INFO:    FCONF: Reading firmware configuration information for: stm32mp_fuse
INFO:    FCONF: Reading firmware configuration information for: stm32mp_io
INFO:    Using SDMMC
INFO:      Instance 1
INFO:    Boot used partition fsbl1
NOTICE:  BL2: v2.10-stm32mp1-r1.0(debug):lts-v2.10.5-dirty(7c229848)
NOTICE:  BL2: Built : 16:19:31, Jun 28 2024
INFO:    BL2: Doing platform setup
INFO:    RAM: DDR3-DDR3L 16bits 400000kHz
ERROR:   DDR addr bus test: can't access memory @ 0xc0000004
PANIC at PC : 0x2ffee075
Exception mode=0x00000016 at: 0x2ffee075

– Internal 5V Short Circuit (Units MK-5, MK-6): A short circuit has been detected on the internal 5V power rail.

– Octavo SiP Overheating (Unit MK-8): The Octavo component exhibits abnormal overheating immediately upon power-up.

– Power Sequencing/Generation Issues (Units MK-9, MK-12, MK-13): These boards fail to generate the required internal voltages.

– Boot Configuration Anomalies (Units MK-10, MK-16):
MK-10: The board boots into DFU mode despite the BOOT footprints being configured for SD card boot.
MK-16: The board is unable to initialize the boot sequence from the SD card.

Could you please advise if these symptoms point toward known assembly sensitivities, specific SiP internal failure modes, or if there are additional diagnostic steps you recommend to isolate the root causes?

Thank you for your assistance.

Best regards,

Maxime GASCHET

[Neeraj Kumar Reddy Dantu]

Maxime,

From your description, it looks like 7/16 boards come up OK and the other 9 have various failure points.

We have seen these kind of failure symptoms when MSL requirements for the SiP packages are not followed. OSD devices are rated MSL-4, which means they need to be used in a certain time frame after opening the bag and stored in humidity controlled environments once the bag is open. Please take a look at Section 9.3 in the datasheet(https://octavosystems.com/wp-content/uploads/2026/04/OSD32MP15x-Datasheet-1.pdf) for Storage Requirements and Baking specifications if the devices have been exposed to moisture.

The baking procedure removes the accumulated moisture from the devices. If the moisture is not removed, it goes through rapid expansion during reflow causing delamination of the substrate inside OSD32MP1. The delaminated spaces will them be filled by nearby solder at reflow temperature, resulting in random shorting of various pins.

We recommend you review the storage logs for the 16 devices and bake the parts accordingly for your next build.

Best,
Neeraj

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