The Practical Guide to Product Development with SiPs Most articles about System-in-Package devices stop at the definition. This one starts
- Austin, TX
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- Austin, TX
- 512-861-3400
The Practical Guide to Product Development with SiPs Most articles about System-in-Package devices stop at the definition. This one starts
Octavo Systems is heading to Embedded World North America 2026 in Anaheim, California, September 22–24. Meet our team and get the latest updates on the OSD62x-PM, OSD32MP2x-PM, and System-in-Package technology.
The OSD32MP2x-PM has been shortlisted for Embedded Solution Product of the Year in the 2026 Instrumentation & Electronics Awards. Learn more about the recognition and cast your vote for Octavo Systems.
Lean embedded teams often juggle hardware, firmware, and software responsibilities. Learn how architecture decisions and System-in-Package (SiP) designs help reduce complexity and protect engineering time.
The hidden costs of discrete design aren’t found in the BOM alone. PCB complexity, component qualification, and supply chain risk can all impact development timelines and product stability. Explore how the OSD32MP15x System-in-Package helps simplify embedded design by integrating critical system functions into a single package.
Most SiP vs SoC comparisons stop at definitions. The real question is how each option affects layout complexity, bring-up risk, development timelines, and your path to a working system. Here’s what the decision actually means in practice.
Most board spins are not caused by mistakes. They are caused by decisions that carry risk into hardware. Here is what a board spin actually costs and why the same teams keep experiencing them.
DDR pricing has nearly tripled in some cases, and availability is increasingly unpredictable. But the real cost is not the price increase. It is the validation work, board spins, and schedule risk that follow every sourcing change. This piece breaks down where DDR risk actually shows up in embedded designs, and why more teams are moving memory complexity upstream.
As embedded systems shrink, where complexity lives matters more than ever. See how System-in-Package integration simplifies DDR routing, reduces risk, and improves performance per area.
Compare SiP and discrete integration beyond BOM cost. Learn where SiP reduces assembly steps, test time, and rework to accelerate embedded hardware ramps.
Why SiP is the Future of Embedded Systems: Insights from Octavo Systems The pace of innovation in embedded electronics is
In today’s fast-paced tech landscape, speed, efficiency, and innovation are more crucial than ever. Whether you’re building a wearable health
Embedded World is just over 2 Weeks away! If you’re like us, you’re busy putting together a plan to navigate
Stargate: Unlocking AI’s Full Potential with Real-Time Contextual Data On January 21, 2025, the announcement of Stargate AI infrastructure was
Optimizing Linux Boot Time on STM32MP1-Based Systems: An Introductory Guide Futuristic spacecraft launching at high speed with fiery exhaust. I
Preliminary Datasheet for the OSD62-PM System-in-Package is Now Available We are excited to announce the availability of the Preliminary Datasheet for the OSD62-PM
Streamlining GUI Development on the STM32MP1 with Embedded Wizard and the OSD32MP1 System-in-Package When working on embedded systems, crafting a
Join Us at Embedded World 2025 in Nuremberg, Germany! We are thrilled to announce our participation in Embedded World 2025, taking
CES 2025: Insights on AI and Robotics The Consumer Electronics Show (CES) is always a whirlwind of innovation, hype, and
What to Expect in 2025 from Octavo Systems and the Semiconductor Industry As we step into 2025, there’s a lot
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.
