Path to Systems: System in Package Technology Article Series

1) Opportunities and Challenges for Next Generation Semiconductor Integration

First in the series, this article explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system in package fits into it all.

2) Why a SiP? Advantages of SiP vs Traditional Semiconductor Manufacturing

Second in the series, this article presents key advantages and challenges ahead for system in package technology (SiP) technology in the grand scheme of semiconductor integration and specifically, embedded systems.

3) System in Package Technology – Leveraging Mass Production on a Small Scale With Semi-Custom SiP

Third in the series, insights into how the design and manufacturing process of semi-customizable system-in-package technology will cut product development time and costs, extending Moore’s vision, creating Moore’s law 2.0.

4) A SiP of Reliable Advantage —Systems Under Test , The Advantages of SiP in Reliability and Testing

Fourth in the series, this article presents how the methodologies of testing and characterization of system in package technology enables higher-quality, more-reliable products.

5) The Time of System in Package Technology Has Arrived!

Fifth in the series, this article presents the customizable future of system in package, in which new tools and processes provide customer-selectable sub-modules while maintaining low design and manufacturing costs.

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Thank you to Electronic Design and editor Bob Wang, for the invitation to author this series of technical articles leveraging our over 100 combined years of semiconductor industry experience.

More about the authors:  Neeraj Dantu is Applications and Systems Engineer, Masood Murtuza is Manager Package Engineering, Erik Welsh is Applications and Systems Manager, and Gene Frantz is Chief Technology Officer at Octavo Systems LLC.