Smallest Industrial Rated OSD335x SiP Now Available

Embedded World (February 27, 2018) – Octavo Systems LLC (Octavo), the expert in System-In-Package (SiP) for mass-market applications, today announced the smallest system ready for Industrial applications with a temperature rating of -40°C to 85°C case.

The OSD3358-512M-ISM, provides OEM and system developers with the tiny 21mm x 21mm 256 ball BGA package of the OSD335x-SM with the added benefit of full industrial temperature range. The OSD335x-SM Industrial integrates the powerful 1GHz ARM® Cortex®-A8 Sitara™ processor from Texas Instruments, DDR3 memory, 2 power supplies and over 100 passives into a single, robust package. This integration removes the need for complicated DDR Routing and power sequencing, speeding up the design cycle

OSD335x-SM Integrates the TI AM335x and over 100 components into one SiP

Applications ranging from Industrial Control and Building Automation to Industrial Internet of Things (IIoT) Sensor Systems will be able to take advantage of the tight integration, simplified design steps and reduced manufacturing costs that commercial customers of the OSD335x-SM utilize today.

Implementation is 60% Smaller than Discrete Components

The OSD335x is 61% smaller than the discrete equivalent
Implementation of the OSD335x-SM Industrial is 60% smaller than discrete components

The Industrial rated version of the OSD335x-SM is footprint and software compatible with the established Commercial version. This means all existing reference designs and development tools already support the new OSD335x-SM Industrial device. This allows a design using the commercial version to be easily upgraded to an industrial rating with a simple BoM change.

Utilizing a SiP makes it easier to design small form factor applications in the IoT world with no routing for DDR memory and power management needed. The BGA design can reduce PCB layers, lowering cost and speeding time to market. Implementation is 60% smaller than using discrete components.

Octavo Systems System-in-Package devices are available through distribution partners, Mouser and Digi-Key.

Octavo Systems will demonstrate the new OSD335x-SM Industrial in Booth #3A-630 at Embedded World 2018, taking place at the Exhibition Centre Nuremberg from February 27 to March 1. Visit them to receive more information on the OSD335x-SM Industrial and the rest of the industry leading OSD335x family.

Please contact our engineers and sales support staff for more information.