System-in-Package Technology Comes to the PC Market
Last week at CES, Intel announced their new CPU family aimed at High End Personal Computers. Normally this would only be tangentially interesting to us. However, this news was right up our alley because Intel announced a System-in-Package (SiP) device geared toward the consumer PC industry. The new 8th generation Core Processors with Radeon RX Vega M Graphics combines the Intel Core CPU with a GPU from AMD and High Speed HBM2 Graphics memory all into a single package.
There have been Multi-Chip Module versions of CPUs with multiple copies of the same die aimed at High End computing before. This is the first time completely unique die performing different functions have been combined into a single package targeted at the PC market. With their 8th Gen Processor, Intel has brought the PC market what Octavo has been delivering to the Embedded Systems market, smaller more powerful systems.
More Performance in Smaller Packages
The integration delivered by the new Intel processor allows their customers to put more performance into smaller form factors. An OEM Laptop using discreet components can go from 32mm thick to only 17mm using the SiP design. This brings a new level of performance to these small form factors
The OSD335x System-In-Package devices do the same thing for embedded systems. Packaging a powerful 1GHz ARM Cortex-A8 processor, DDR, and power into a small single package allows system designers to put full Linux capable systems into areas where they couldn’t before. This means smarter machines, more accurate sensors, and more “personal” electronics.
Space Savings Leading to a Better Experience
The space savings from SiP technology integration is significant and opens up opportunities for customers to innovate. The OSD335x-SM saves over 60% of the board space required by an equivalent discrete solution. This space savings enables our customers to create new and differentiated versions of their product. They could use the extra space to add more batteries, shrink the overall system, or add new features.
Dell was able to save “several square inches of space” in their latest laptops from the Intel SiP. According to a Venture Beat article, Dell used this space savings to add bigger batteries and extend battery life, providing an overall better user experience. This is just one example of SiP giving designers more freedom and more time to focus on their systems.
Welcome Intel
We strongly believe every aspect of the electronics industry can benefit from SiP technology. Intel’s entrance into the market is a welcome one. It adds validity to our vision and will bring more visibility and resources to System-In-Package technology. Octavo is very excited about Intel’s announcement and we will continue to deliver unique SiP solutions that allow you to more easily create the next great thing.
