Nuremberg, Germany — April 9, 2024 — Octavo Systems, a leader in system integration technology, proudly announces the launch of its OSD32MP2 family, featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM. Designed to leverage the advanced capabilities of the new STM32MP25 processor from STMicroelectronics, this family is set to transform electronics design by significantly reducing complexity, size, and total cost of ownership.
The OSD32MP2 family caters to a diverse range of applications, from industrial automation to consumer electronics, offering unparalleled processing power, connectivity, and security features. The series includes:
OSD32MP2: A comprehensive SiP solution integrating the STM32MP2 processor, DDR4 memory, power management (STMPMIC2), EEPROM, oscillators, and passives into a 21mm x 21mm BGA package. This module is designed for designers seeking a straightforward, efficient path to harnessing the full capabilities of the STM32MP2.
OSD32MP2-PM: A streamlined module focusing on the essential integration of the STM32MP2 processor and DDR4 memory in a compact 9mm x 14mm package, ideal for cost-sensitive or uniquely designed projects requiring flexibility in power solutions or form factors.
Innovative Features for Advanced Designs
The OSD32MP2 series is built around the STM32MP25 processor, featuring a dual Arm Cortex-A35 cores, an Arm Cortex-M33 core, a 3D GPU supporting Vulkan API, H.264 video encoding/decoding, a 1.35 TOPS AI accelerator, and comprehensive connectivity options. These features enable the development of cutting-edge applications that demand high-performance processing, advanced graphics, and robust security.
Empowering Electronics Design Engineers
“Octavo Systems is committed to empowering electronics design engineers by simplifying the complexities of modern electronic design,” said Harley Walsh, President of Octavo Systems. “Our OSD32MP2 series allows engineers to focus on innovation and product differentiation, providing them with the tools to bring their ideas to market faster and more efficiently than ever before.”
The OSD32MP2 reduces design time and size by up to 60%, offering the lowest total cost of ownership. The OSD32MP2-PM offers a flexible option for designs requiring a unique form factor or power solution, making it ideal for wearable technology or other innovative applications.
Availability
Samples of the OSD32MP2-PM will be available at the end of 2024, with the OSD32MP2 samples following in early 2025. For additional information, including detailed specifications and ordering details, please visit https://octavosystems.com or contact Octavo Systems at sales@octavosystems.com.
About Octavo Systems
Octavo Systems is at the forefront of System-in-Package technology, dedicated to making electronic design simpler, faster, and more cost-effective. With a focus on integrating complex systems into compact, efficient packages, Octavo Systems is paving the way for the future of electronics design.
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The security of embedded systems stands as a crucial yet often overlooked aspect. As technology propels forward, these systems become increasingly central to our everyday lives, powering everything from smartphones to critical infrastructure.
However, with this technological integration comes a heightened vulnerability to physical attack vectors. The need to protect these systems from such threats has never been more pressing. As designers and engineers, understanding and mitigating these risks is not just a challenge but a requirement.
This article aims to shine a light on the various physical attack vectors threatening embedded systems and explore how advancements in System-in-Package (SiP) technology are revolutionizing our approach to securing these vital components of the modern technological landscape.
In the rapidly evolving landscape of technology, embedded systems have become the backbone of modern electronic devices, ranging from simple household appliances to complex industrial machines. As these devices become more interconnected, the importance of security in embedded systems cannot be overstated. For professionals involved in electronic product design, ensuring the security of these systems is paramount.
The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.
For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial.
Artificial intelligence (AI) once seemed like a figment of science fiction, but as technology has evolved, many new and exciting applications have arisen. From national security to finance, healthcare, and beyond, AI has the capacity to improve the quality and quantity of data analytics and reduce costs. As the ubiquity of AI technology continues to grow, we see it moving closer to the edge, requiring specialized hardware to ensure that AI-enabled devices can operate and process data efficiently.
What is AI at the Edge?
AI at the edge relies on edge computing – a distributed network of computing devices that exist near the source of data, rather than in a data center. This includes Internet of Things (IoT) devices that could be sensors and smart devices that reside within a home, business, or other location. Because the Internet is a global network, the edge could exist anywhere.
Compared to AI algorithms that run inside of a data center, edge AI can offer a number of important benefits that include:
Reduced latency since data is processed locally.
Increased data security since data is processed at the edge and only results are transmitted , reducing the risk of a breach or interception.
Improved reliability since the AI can run even if connection to a data center goes down.
Real-time insights since data is processed locally instead of in a distant data center.
Octavo Systems, a leader in providing highly integrated System-in-Package technology solutions, is excited to announce the production release of the powerful OSDZU3 System-in-Package (SiP) and the OSDZU3-REF, an open-source development and evaluation platform. Both products are available for order through our distribution partner, Avnet.
Nuremberg, Germany (March 14, 2023) – Expanding on its history of delivering highly integrated System-in-Package (SiP) devices, Octavo Systems announced its OSD62x family of SiPs that help expand the performance of edge and small form factor embedded processing into next generation applications. The OSD62x family is based on the Texas Instruments (TI) AM623 and AM625 processors. The OSD62x enables small-size human-machine interface (HMI) applications for building automation, industrial control, IoT gateways, artificial intelligence (AI) at the edge, as well as many other low-power systems demanding high performance Linux processing. Delivering the smallest AM62x module form factor, the OSD62x SiP family integrates high-speed memory, power management, passive components, and much more into a single BGA package.
“The OSD62x is a powerful example of our commitment to deliver ‘Innovation through Integration.’ We are excited to offer our customers a TI AM62x-based solution that reduces solution sizes by 60% and enables designs to get to market up to 9 months faster,” said Harley Walsh, President at Octavo Systems. (Read More…)
Houston, Texas, United States (March 1, 2023) – Octavo Systems LLC, a leading provider of System-in-Package (SiP) solutions, has officially released its latest offering, the OSDZU3-REF Development Platform. This platform gives system designers a comprehensive development environment for evaluating, testing, and starting product development using the OSDZU3 System-in-Package (SiP).
Built around the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, the OSDZU3 SiP integrates LPDDR4, a Flexible Power System, EEPROM, Oscillators, and hundreds of passive components into a compact 20.5mm x 40mm BGA.
The OSDZU3-REF platform features standard peripherals such as 1Gb Ethernet, USB-C, Display Port, and SATA, and provides expandability through PMOD headers, Mikroe Click™, standard 100Mil headers, and an FMC LPC Connector. It also features an Onboard µUSB JTAG debugger, a µUSB UART connection and access to both SYSMON and PMBUS through standard 100mil connectors.
Octavo Systems leveraged the integration provided by the OSDZU3 SiP to create the OSDZU3-REF using just four PCB layers with low-cost design rules. “The OSDZU3-REF highlights the benefits of using an Octavo SiP to simplify and reduce the cost of your system, “says Erik Welsh, CTO of Octavo Systems. “Without the OSDZU3 SiP, this reference platform would need 8 to 12 layers with much more complex design rules to support the AMD-Xilinx MPSoC, the power system, and the LPDDR4.” (Read More…)
