The OSD32MP2x System-in-Package (SiP) integrates the STMicroelectronics STM32MP2 processor with DDR4 memory, STPMIC2 PMIC, EEPROM, Oscillators and passives into a compact 21mm x 21mm BGA package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your STM32MP2 based design.

The OSD32MP2x-PM System-in-Package (SiP) integrates the ST Microelectronics STM32MP2 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD32MP2x-PM offers the full functionality of the STM32MP2 in a significantly smaller form factor, making it suitable for new, space-constrained applications.

The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the AM62x processors to get to their design to market faster and in a smaller form factor.  It  enables them to build the next generation of  building and industrial automation/control,  IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus features that will differentiate their product instead of getting the spending time getting the processor to function.

The OSDZU3-REF is the official development platform for the AMD ZU3 System in Package, the OSDZU3. It provides a host of connectors and expansion headers providing an excellent foundation to evaluate the OSDZU3 in your application. It comes with a PetaLinux distribution that features a number of demos that allow you to get up and running in no time.

The OSDZU3 integrates the AMD Zynq Ultrascale+ MPSoC ZU3, LPDDR4 memory, 2x Infineon IRPS5401 PMICs, 2x LDOs, EEPROM, QSPI Flash, 2x Oscillators, and passives into a 40mm x 20.5mm 600 Ball BGA.

The OSD32MP1-BRK is a small flexible prototyping platform for the STM32MP1 based SiP, the OSD32MP15x.  At only 3in X 1.8in (75mm X 46mm), provides easy access to the I/O of the STM32MP1 through a set of breadboard compatible headers.  The OSD32MP1-BRK allows developers to quickly build a proof of concept that more closely resembles their actual system without the need to build their own custom hardware.

The OSD32MP1-RED is the Reference, Evaluation, Development platform for the OSD32MP15x family of SiP devices. It is designed to enable quick evaluation of the OSD32MP15x in your specific application. It has a number of industry standard connectors, plus access to a host of peripherals, and connectivity options including WiFi and Bluetooth. Running a completely opensource Debian Distribution the OSD32MP1-RED allows quick prototyping in both hardware and software.

All of the hardware design files and software are freely available as Opensource so it can be used as a known good starting point for new designs.

The OSD32MP15x integrates the STMicroelectronics STM32MP1 featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4 along with up to 1GB DDR3, STPMIC1 Power Management IC, EEPROM, MEMS Oscillator, and passives into single 18mm x 18mm BGA package.

The OSD335x C-SiP is a Complete System-in-Package Device. It integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TL5209 LDO, TPS65217C PMIC, 4KB of EEPROM, eMMC non-volatile Storage, a MEMS Oscillator and all the needed passives, into a 27mm x 27mm 400 Ball BGA.

The OSD335x-SM integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TL5209 LDO, TPS65217C PMIC, all the needed passives, and 4KB of EEPROM into a 21mm x 21mm 256 Ball BGA.

The Quickest and Most Cost-effective way to develop with the STM32MP2

STM32MP2 + DDR4 in a Small Flexible Package

A Powerful Development Platform for the OSDZU3

Performance, Flexibility, and Simplicity

Flexible Prototyping Platform

Full Featured Development Platform

First STM32MP15x System in Package

Most Integration

Smallest Design