Our CTO, Gene Frantz, published an article on Embedded Computing last week titled System-In-Package: The Next Step of Integration. In his article, he poses an interesting question: How do small, innovative companies work with larger semiconductor manufacturers to further integrate their designs? He outlined four questions that need to be answered “YES” before a large S/C manufacturer will agree to work with any company for a custom integration.
What happens, however, if you can’t answer “YES” to all of them? Are you out of luck? Is there no path to further integration? Not quite. Gene points out that there just might be a way forward with the advances made by Octavo.
I want to take a minute to dive a little deeper into this statement. Why do we think we can offer an alternative path of integration for innovative organizations? The answer is simple. There are three key factors that enable us to provide these solutions:
In a nutshell, if you have an electronic design and are looking for an integration path, you have two options. You can go to a large S/C manufacturer to see if you’ll pass their four tests, or you can contact us and see what we can do for you.